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CMT Series Industrial Motherboard

CMT Series Industrial Motherboard

Features:

  • Supports Intel® 6th to 9th Gen Core™ i3/i5/i7 processors, TDP=65W

  • Equipped with the Intel® Q170 chipset
  • Two DDR4-2666MHz SO-DIMM memory slots, supporting up to 32GB
  • Onboard two Intel Gigabit network cards
  • Rich I/O signals including PCIe, DDI, SATA, TTL, LPC, etc.
  • Utilizes a high-reliability COM-Express connector to meet the needs for high-speed signal transmission
  • Default floating ground design

  • Remote management

    Remote management

  • Condition monitoring

    Condition monitoring

  • Remote operation and maintenance

    Remote operation and maintenance

  • Safety Control

    Safety Control

Product Description

The APQ core modules CMT-Q170 and CMT-TGLU represent a leap forward in compact, high-performance computing solutions designed for applications where space is at a premium. The CMT-Q170 module caters to a range of demanding computing tasks with support for Intel® 6th to 9th Gen Core™ processors, bolstered by the Intel® Q170 chipset for superior stability and compatibility. It features two DDR4-2666MHz SO-DIMM slots capable of handling up to 32GB of memory, making it well-suited for intensive data processing and multitasking. With a broad array of I/O interfaces including PCIe, DDI, SATA, TTL, and LPC, the module is primed for professional expansion. The use of a high-reliability COM-Express connector ensures high-speed signal transmission, while a default floating ground design enhances electromagnetic compatibility, making the CMT-Q170 a robust choice for applications requiring precise and stable operations.

On the other hand, the CMT-TGLU module is tailored for mobile and space-constrained environments, supporting Intel® 11th Gen Core™ i3/i5/i7-U mobile processors. This module is equipped with a DDR4-3200MHz SO-DIMM slot, supporting up to 32GB of memory to cater to heavy data processing needs. Similar to its counterpart, it offers a rich suite of I/O interfaces for extensive professional expansion and utilizes a high-reliability COM-Express connector for dependable high-speed signal transmission. The module’s design prioritizes signal integrity and resistance to interference, ensuring stable and efficient performance across various applications. Collectively, the APQ CMT-Q170 and CMT-TGLU core modules are indispensable for developers seeking compact, high-performance computing solutions in robotics, machine vision, portable computing, and other specialized applications where efficiency and reliability are paramount.

INTRODUCTION

Engineering Drawing

File Download

CMT-Q170
CMT-TGLU
CMT-Q170
Model CMT-Q170/C236
Processor System CPU Intel® 6~9th Generation CoreTM Desktop CPU
TDP 65W
Socket LGA1151
Chipset Intel® Q170/C236
BIOS AMI 128 Mbit SPI
Memory Socket 2 * SO-DIMM Slot, Dual Channel DDR4 up to 2666MHz
Capacity 32GB, Single Max. 16GB
Graphics Controller Intel® HD Graphics530/Intel® UHD Graphics 630 (dependent on CPU)
Ethernet Controller 1 * Intel® i210-AT GbE LAN Chip (10/100/1000 Mbps)
1 * Intel® i219-LM/V GbE LAN Chip (10/100/1000 Mbps)
Expansion I/O PCIe 1 * PCIe x16 gen3, bifurcatable to 2 x8
2 * PCIe x4 Gen3, bifurcatable to 1 x4/2 x2/4 x1
1 * PCIe x4 Gen3, bifurcatable to 1 x4/2 x2/4 x1(Optional NVMe, Default NVMe)
1 * PCIe x4 Gen3, bifurcatable to 1 x4/2 x2/4 x1(Optional 4 * SATA, Default 4 * SATA)
2 * PCIe x1 Gen3
NVMe 1 Ports (PCIe x4 Gen3+SATA Ill,Optional 1 * PCIe x4 Gen3, bifurcatable to 1 x4/2 x2/4 x1, Default NVMe)
SATA 4 Ports support SATA Ill 6.0Gb/s (Optional 1 * PCIe x4 Gen3, bifurcatable to 1 x4/2 x2/4 x1, Default 4 * SATA)
USB3.0 6 Ports
USB2.0 14 Ports
Audio 1 * HDA
Display 2 * DDI
1 * eDP
Serial 6 * UART(COM1/2 9-Wire)
GPIO 16 * bits DIO
Other 1 * SPI
1 * LPC
1 * SMBUS
1 * I2C
1 * SYS FAN
8 * USB GPIO Power On/Off
Internal I/O Memory 2 * DDR4 SO-DIMM Slot
B2B Connector 3 * 220Pin COM-Express connector
FAN 1 * CPU FAN (4x1Pin, MX1.25)
Power Supply Type ATX: Vin, VSB; AT: Vin
Supply Voltage Vin:12V
VSB:5V
OS Support Windows Windows 7/10
Linux Linux
Watchdog Output System Reset
Interval Programmable 1 ~ 255 sec
Mechanical Dimensions 146.8mm * 105mm
Environment Operating Temperature -20 ~ 60℃
Storage Temperature -40 ~ 80℃
Relative Humidity 10 to 95% RH (non-condensing)
CMT-TGLU
Model CMT-TGLU
Processor System CPU Intel® 11th Generation CoreTM i3/i5/i7 Mobile CPU
TDP 28W
Chipset SOC
Memory Socket 1 * DDR4 SO-DIMM Slot, up to 3200MHz
Capacity Max. 32GB
Ethernet Controller 1 * Intel® i210-AT GbE LAN Chip (10/100/1000 Mbps)

1 * Intel® i219-LM/V GbE LAN Chip (10/100/1000 Mbps)

Expansion I/O PCIe 1 * PCIe x4 Gen3, Bifurcatable to 1 x4/2 x2/4 x1

1 * PCIe x4(From CPU,only support SSD)

2 * PCIe x1 Gen3

1 * PCIe x1(Optional 1 * SATA)

NVMe 1 Port (From CPU,only support SSD)
SATA 1 Port support SATA Ill 6.0Gb/s (Optional 1 * PCIe x1 Gen3)
USB3.0 4 Ports
USB2.0 10 Ports
Audio 1 * HDA
Display 2 * DDI

1 * eDP

Serial 6 * UART (COM1/2 9-Wire)
GPIO 16 * bits DIO
Other 1 * SPI
1 * LPC
1 * SMBUS
1 * I2C
1 * SYS FAN
8 * USB GPIO Power On/Off
Internal I/O Memory 1 * DDR4 SO-DIMM Slot
B2B Connector 2 * 220Pin COM-Express connector
FAN 1 * CPU FAN (4x1Pin, MX1.25)
Power Supply Type ATX: Vin, VSB; AT: Vin
Supply Voltage Vin:12V

VSB:5V

OS Support Windows Windows 10
Linux Linux
Mechanical Dimensions 110mm * 85mm
Environment Operating Temperature -20 ~ 60℃
Storage Temperature -40 ~ 80℃
Relative Humidity 10 to 95% RH (non-condensing)

CMT-Q170

CMT-Q170-20231226_00

CMT-TGLU

CMT-TGLU-20231225_00

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