Remote management
Condition monitoring
Remote operation and maintenance
Safety Control
The APQ core modules CMT-Q170 and CMT-TGLU represent a leap forward in compact, high-performance computing solutions designed for applications where space is at a premium. The CMT-Q170 module caters to a range of demanding computing tasks with support for Intel® 6th to 9th Gen Core™ processors, bolstered by the Intel® Q170 chipset for superior stability and compatibility. It features two DDR4-2666MHz SO-DIMM slots capable of handling up to 32GB of memory, making it well-suited for intensive data processing and multitasking. With a broad array of I/O interfaces including PCIe, DDI, SATA, TTL, and LPC, the module is primed for professional expansion. The use of a high-reliability COM-Express connector ensures high-speed signal transmission, while a default floating ground design enhances electromagnetic compatibility, making the CMT-Q170 a robust choice for applications requiring precise and stable operations.
On the other hand, the CMT-TGLU module is tailored for mobile and space-constrained environments, supporting Intel® 11th Gen Core™ i3/i5/i7-U mobile processors. This module is equipped with a DDR4-3200MHz SO-DIMM slot, supporting up to 32GB of memory to cater to heavy data processing needs. Similar to its counterpart, it offers a rich suite of I/O interfaces for extensive professional expansion and utilizes a high-reliability COM-Express connector for dependable high-speed signal transmission. The module’s design prioritizes signal integrity and resistance to interference, ensuring stable and efficient performance across various applications. Collectively, the APQ CMT-Q170 and CMT-TGLU core modules are indispensable for developers seeking compact, high-performance computing solutions in robotics, machine vision, portable computing, and other specialized applications where efficiency and reliability are paramount.
Model | CMT-Q170/C236 | |
Processor System | CPU | Intel® 6~9th Generation CoreTM Desktop CPU |
TDP | 65W | |
Socket | LGA1151 | |
Chipset | Intel® Q170/C236 | |
BIOS | AMI 128 Mbit SPI | |
Memory | Socket | 2 * SO-DIMM Slot, Dual Channel DDR4 up to 2666MHz |
Capacity | 32GB, Single Max. 16GB | |
Graphics | Controller | Intel® HD Graphics530/Intel® UHD Graphics 630 (dependent on CPU) |
Ethernet | Controller | 1 * Intel® i210-AT GbE LAN Chip (10/100/1000 Mbps) 1 * Intel® i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
Expansion I/O | PCIe | 1 * PCIe x16 gen3, bifurcatable to 2 x8 2 * PCIe x4 Gen3, bifurcatable to 1 x4/2 x2/4 x1 1 * PCIe x4 Gen3, bifurcatable to 1 x4/2 x2/4 x1(Optional NVMe, Default NVMe) 1 * PCIe x4 Gen3, bifurcatable to 1 x4/2 x2/4 x1(Optional 4 * SATA, Default 4 * SATA) 2 * PCIe x1 Gen3 |
NVMe | 1 Ports (PCIe x4 Gen3+SATA Ill,Optional 1 * PCIe x4 Gen3, bifurcatable to 1 x4/2 x2/4 x1, Default NVMe) | |
SATA | 4 Ports support SATA Ill 6.0Gb/s (Optional 1 * PCIe x4 Gen3, bifurcatable to 1 x4/2 x2/4 x1, Default 4 * SATA) | |
USB3.0 | 6 Ports | |
USB2.0 | 14 Ports | |
Audio | 1 * HDA | |
Display | 2 * DDI 1 * eDP |
|
Serial | 6 * UART(COM1/2 9-Wire) | |
GPIO | 16 * bits DIO | |
Other | 1 * SPI | |
1 * LPC | ||
1 * SMBUS | ||
1 * I2C | ||
1 * SYS FAN | ||
8 * USB GPIO Power On/Off | ||
Internal I/O | Memory | 2 * DDR4 SO-DIMM Slot |
B2B Connector | 3 * 220Pin COM-Express connector | |
FAN | 1 * CPU FAN (4x1Pin, MX1.25) | |
Power Supply | Type | ATX: Vin, VSB; AT: Vin |
Supply Voltage | Vin:12V VSB:5V |
|
OS Support | Windows | Windows 7/10 |
Linux | Linux | |
Watchdog | Output | System Reset |
Interval | Programmable 1 ~ 255 sec | |
Mechanical | Dimensions | 146.8mm * 105mm |
Environment | Operating Temperature | -20 ~ 60℃ |
Storage Temperature | -40 ~ 80℃ | |
Relative Humidity | 10 to 95% RH (non-condensing) |
Model | CMT-TGLU | |
Processor System | CPU | Intel® 11th Generation CoreTM i3/i5/i7 Mobile CPU |
TDP | 28W | |
Chipset | SOC | |
Memory | Socket | 1 * DDR4 SO-DIMM Slot, up to 3200MHz |
Capacity | Max. 32GB | |
Ethernet | Controller | 1 * Intel® i210-AT GbE LAN Chip (10/100/1000 Mbps)
1 * Intel® i219-LM/V GbE LAN Chip (10/100/1000 Mbps) |
Expansion I/O | PCIe | 1 * PCIe x4 Gen3, Bifurcatable to 1 x4/2 x2/4 x1
1 * PCIe x4(From CPU,only support SSD) 2 * PCIe x1 Gen3 1 * PCIe x1(Optional 1 * SATA) |
NVMe | 1 Port (From CPU,only support SSD) | |
SATA | 1 Port support SATA Ill 6.0Gb/s (Optional 1 * PCIe x1 Gen3) | |
USB3.0 | 4 Ports | |
USB2.0 | 10 Ports | |
Audio | 1 * HDA | |
Display | 2 * DDI
1 * eDP |
|
Serial | 6 * UART (COM1/2 9-Wire) | |
GPIO | 16 * bits DIO | |
Other | 1 * SPI | |
1 * LPC | ||
1 * SMBUS | ||
1 * I2C | ||
1 * SYS FAN | ||
8 * USB GPIO Power On/Off | ||
Internal I/O | Memory | 1 * DDR4 SO-DIMM Slot |
B2B Connector | 2 * 220Pin COM-Express connector | |
FAN | 1 * CPU FAN (4x1Pin, MX1.25) | |
Power Supply | Type | ATX: Vin, VSB; AT: Vin |
Supply Voltage | Vin:12V
VSB:5V |
|
OS Support | Windows | Windows 10 |
Linux | Linux | |
Mechanical | Dimensions | 110mm * 85mm |
Environment | Operating Temperature | -20 ~ 60℃ |
Storage Temperature | -40 ~ 80℃ | |
Relative Humidity | 10 to 95% RH (non-condensing) |
Effective, safe and reliable. Our equipment guarantees the right solution for any requirement. Benefit from our industry expertise and generate added value - every day.
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