E6 Embedded Industrial PC

Features:

Utilizes Intel® 11th-U mobile platform CPU
Integrates dual Intel® Gigabit network cards
Two onboard display interfaces
Supports dual hard drive storage, with 2.5” hard drive featuring a pull-out design
Supports APQ aDoor Bus module expansion
Supports WiFi/4G wireless expansion
Supports 12~28V DC wide voltage power supply
Compact body, fanless design, with detachable heatsink

Remote management
Condition monitoring
Remote operation and maintenance
Safety Control

Product Description

The APQ Embedded Industrial PC E6 Series 11th-U platform is a compact computer designed specifically for industrial automation and edge computing applications. It utilizes an Intel® 11th-U mobile platform CPU, characterized by high performance and low power consumption, ensuring stable operation in various industrial environments. Integrated dual Intel® Gigabit network cards provide high-speed and stable network connections to meet the demands of data transmission and communication. Equipped with two onboard display interfaces, it supports multiple display outputs. Dual hard drive support allows the E6 Series to meet the needs for substantial data storage, with a 2.5” hard drive featuring a pull-out design for enhanced convenience and expandability. Support for APQ aDoor Bus module expansion allows for customized configurations based on specific application needs, meeting the demands of various complex industrial automation requirements. Support for WiFi/4G wireless expansion facilitates wireless connections and control, further expanding its application scenarios. Support for a 12~28V DC wide voltage power supply adapts to different power environments, ensuring stable operation under various working conditions. Additionally, this series features a compact body design and a fanless cooling system, making it suitable for use in confined spaces.

The APQ E6 Series Embedded Industrial PC is widely used in factory and machine automation scenarios. Its flexible fanless and fanned options, along with reinforced structure design, ensure these systems can withstand the demands of harsh industrial environments.

INTRODUCTION

Engineering Drawing

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Model	E6
Processor System	CPU	Intel^® 11^th Generation Core™ i3/i5/i7 Mobile -U CPU
	Chipset	SOC
	BIOS	AMI EFI BIOS
Memory	Socket	2 * DDR4-3200 MHz SO-DIMM Slot
Memory	Max Capacity	64GB, Single Max. 32GB
Graphics	Controller	Intel^®UHD Graphics/Intel^® Iris^® Xe Graphics (dependent on CPU type)
Ethernet	Controller	1 * Intel^® i210-AT (10/100/1000/2500 Mbps, RJ45) 1 * Intel^® i219 (10/100/1000 Mbps, RJ45)
Storage	SATA	1 * SATA3.0 Connector
Storage	M.2	1 * M.2 Key-M (PCIe x4 Gen 3 + SATA3.0, Auto Detect, 2280)
Expansion Slots	aDoor Bus	1 * aDoor Bus (16GPIO + 4PCIe + 1*I2C)
Expansion Slots	Mini PCIe	1 * Mini PCIe Slot (PCIe x1+USB 2.0, with 1 * SIM Card) 1 * Mini PCIe Slot (PCIe x1+USB 2.0)
Front I/O	USB	2 * USB3.2 Gen2x1 (Type-A) 2 * USB3.2 Gen1x1 (Type-A)
	Ethernet	2 * RJ45
	Display	1 * DP: up to 4096x2304 @ 60Hz 1 * HDMI (Type-A): up to 3840x2160 @ 24Hz
	Serial	2 * RS232/485 (COM1/2, DB9/M, BIOS control)
	Switch	1 * AT/ATX Mode Switch (Enable/Disable automatically power on)
	Button	1 * Reset (hold down 0.2 to 1s to restart, 3s to clear CMOS) 1 * OS Rec (system recovery)
	Power	1 * Power Input Connector (12~28V)
Rear I/O	USB	1 * Type-C
	SIM	1 * Nano SIM Card Slot
	Button	1 * Power Button + Power LED 1 * PS_ON
	Audio	1 * 3.5mm Audio Jack (Line-Out + MIC, CTIA)
Internal I/O	Front Panel	1 * Front Panel (wafer, 3x2Pin, PHD2.0)
	FAN	1 * CPU FAN (wafer) 1 * SYS FAN (wafer)
	Serial	1 * COM3/4 (wafer) 1 * COM5/6 (wafer)
	USB	4 * USB2.0 (wafer)
	Display	1 * LVDS (wafer)
	LPC	1 * LPC (wafer)
	Storage	1 * SATA3.0 7Pin Connector 1 * SATA Power
	Audio	1 * Speaker (2-W (per channel)/8-Ω Loads, wafer)
	GPIO	1 * 16bits DIO (8xDI and 8xDO, wafer)
Power Supply	Type	DC
	Power Input Voltage	12~28VDC
	Connector	1 * 2Pin Power Input Connector (P=5.08mm)
	RTC Battery	CR2032 Coin Cell
OS Support	Windows	Windows 10
OS Support	Linux	Linux
Watchdog	Output	System Reset
Watchdog	Interval	Programmable 1 ~ 255 sec
Mechanical	Enclosure Material	Radiator: Aluminum, Box: SGCC
	Dimensions	249mm(L) * 152mm(W) * 55.5mm(H)
	Weight	Net: 1.8Kg Total: 2.8Kg
	Mounting	VESA, Wallmount, Desk mounting
Environment	Heat Dissipation System	Passive heat dissipation
	Operating Temperature	-20~60℃
	Storage Temperature	-40~80℃
	Relative Humidity	5 to 95% RH (non-condensing)
	Vibration During Operation	With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis)
	Shock During Operation	With SSD: IEC 60068-2-27 (30G, half sine, 11ms)

E6_SpecSheet_APQ

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