Solution

Application Cases of Wafer Transport Robots

Application Cases of Wafer Transport Robots

Application Cases of Wafer Transport Robots
  • Low latency, scalable dedicated AI accelerator
  • MCU supports real-time motor control
  • ROS2 with DDS enables timely communication and interoperability

Compact robot controller

U80X1OTIBM-T

TAC-3000-NX

  • Support NVIDIA ® JetsonTM SO-DIMM connector core board
  • High performance AI controller with up to 100TOPS computing power
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5G LTE 

  • TDD LTE/FDD LTE/WCDMA/GPS
  • Support Region: Global

Ready to use standard systems: rapid construction and expansion

  • Production board facilitates sample development and large-scale deployment
  • Up to 100 TOPS (INT8) of computing power
  • Supports JetPackTM 5.1 SDK

 

Small size to adapt to narrow spaces

  • Easily deploy products to various application scenarios without sacrificing space
  • Adopting modular heat dissipation design to adapt to a unified quasi system design

 

Scalable I/O design to meet different application requirements

  • M.2 extensions for initiating and wireless connections: M key for NVMe and B key for wireless applications
  • Connect edge devices and peripheral devices through USB, RS-485, GPIO, CAN, and LAN

Application Cases of Wafer Transport Robots

Application challenges

  • Ensure stability and flexibility, reduce vibration
  • Improve the accuracy of obstacle avoidance
  • Maintain a higher level of security during human-machine collaboration
  • The design of the robot needs to be fine tuned to meet the requirements of the cleanroom

 

Solution

  • Compact design with a vibration tolerance of 3.5 Grms
  • Sensor fusion requires safe and accurate navigation of automatic meter reading systems
  • Used to integrate a simple ROS/ROS2 development ready environment
  • 21TOPS native AI reasoning ability provides computing power support for obstacle avoidance

 

Advantages of the plan

  • Easy to deploy production lines and factory automatic meter reading systems
  • Enhanced data processing from sensing, driving to integration
  • Lower power consumption requirements and higher edge AI performance
  • Shortened development time and improved efficiency
  • Flexible design for internal logistics and AMR demand adjustment
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